Heat shrinkable laminates for packaging

Patent Name Heat Shrinkable Laminates for Packaging Patents Patent Applicant Nemours Dupont Principal Applicant Address Wilmington, Del., USA Inventor T.D. Kendy Application (Patent) No. 02816335.4 Date of Application 2002.08.21 Approval Date Approval Notice No. 1545446 Auditing Announcement Date 2004.11.10 Instruction CD-ROM D0445 Main Classification No. B32B27/08 Classification No. B32B27/08; B32B27/36 Subsidiary Original Application No. Priority Item Abstract Heat Shrinkable Film Laminate Containing (a) A heat-shrinkable film, (b) a solvent-free adhesive, and (c) a film having at least a 5% lower thermal shrinkage than the heat-shrinkable film (a). Preferably the laminate further contains (d) a spacer layer adjacent to (a). SATUM 1, a heat-shrinkable film laminate for packaging, comprising in order: (a) a heat-shrinkable film comprising a polymer containing at least 80 wt% of polyethylene terephthalate, wherein said film Biaxially oriented from about 5% to about 55%, the film having an outer surface and an inner surface; and (b) a solventless adhesive layer; and (c) a heat shrinkage rate less than (a) at least 5% Film.